View BD93941FP-E2_8689718.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

datashee t product structure silicon monolithic integrated circuit this product has not designed prot ection against radioactive rays . 1/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 tsz22111 ? 14 ? 001 www.rohm.com led drivers for lcd backlights white led driver for large lcd panels (dcdc converter type) bd93941efv bd93941fp general description bd93941efv and bd93941fp is a high efficiency driver for white leds and designed for large lcds. these ics are built-in a boost dcdc converters that employ an array of leds as the light source. bd93941efv and bd93941fp have some protect function against fault conditions, such as the over-voltage protection (ovp), the over current limit prot ection of dcdc (ocp), the short circuit protection (scp), the open detection of led string. therefore bd93941efv and bd93941fp are available for the fail-safe design over a wide range output voltage. key specification ? operating power supply voltage range: 9.0v to 35.0v ? led minimum current 30ma ? led maximum current: 200ma ? oscillator frequency: 150khz (rt=100k ? ) ? operating current: 4.5ma (typ.) ? operating temperature range: -40c to +85c applications tv, computer display, notebook, lcd backlighting package w(typ.) x d(typ.) x h(max.) htssop-b20 6.50mm x 6.40mm x 1.00mm hsop20 14.90mm x 7.80mm x 2.10mm features ? 4ch led constant current driver and dc/dc converter ? maximum led current: 200ma ? led feedback voltage: 0.37v (@adim=2.5v) so lower heat. adjustable feed back voltage by following led current setting. ? ? 2% led current accuracy (adim=2.5v, when each led is set to 100ma) ? analog current (linear) dimming at adim pin ? led pin rating 60v ? individual detection and individual led off for both open and short circuits ? built-in iset pin short-circuit protection circuit ? set soft-start time by external capacitor. ? fets gate (n pin) is driven by 5.8v swing ? built-in vout discharge circuit for shutdown ? built-in vout overvoltage protection (ovp) / reduced voltage protection (scp) circuit ? htssop-b20 and hsop20 package with high heat radiation efficiency typical application circuit figure 2. typical application circuit _ _ figure 1(a). htssop-b20 (bd93941efv) figure 1(b). hsop20 (bd93941fp) downloaded from: http:///
datasheet d a t a s h e e t 2/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp _ _ absolute maximum ratings (ta=25c) parameter symbol ratings unit power supply voltage vcc 36 v stb, adim, ovp, pwm terminal voltage stb, adim, ovp, pwm 36 v led1 to 4 terminal voltage led1 to 4 60 v auto, reg58, cs, n, iset, ss, fb, rt terminal voltage auto, reg58, cs, n, iset, ss, fb, rt 7 v power dissipation (htssop-b20) (hsop20) pd1 pd2 3.20 *1 2.18 *2 w operating temperature ran ge topr -40 to +85 c storage temperature range tstg -55 to +150 c junction temperature tjmax 150 c *1 ta = 25c or more, diminished at -25.6mw/c in the case of htssop-b20 (when 4-layer / 70.0 mm x 70. 0 mm x 1.6 mm board is mounted) *2 ta = 25c or more, diminished at -17.4mw/c in the case of hsop20 (when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounted) operating ratings parameter symbol limits unit vcc supply voltage vcc 9.0 to 35.0 v min. output current of led1 to 4 iled_min 30 ma *1 max. output current of led1 to 4 iled_max 200 ma *1,2 adim input voltage1 (use adim function) vadim1 0.2 to 2.7 (normal op.) 1.0 to 2.7 (start up) v *3 adim input voltage1 (dont use adim function) vadim2 reg58 to 35.0 v dc/dc oscillation frequency fsw 100 to 800 khz min. on-duty time for pwm light modulation pwm_min 30 s *1 the amount of current per channel. *2 if led makes significant variations in its reference voltage, the driver will increase power dissipation, resulting in a ri se in package temperature. to avoid this problem, design the board with thor ough consideration given to heat radiation measures. *3 to avoid unused led pins misdetection, set adim with in 1.0v to 2.7v at start up stage. after unused led pins detection, set adim within 0.2v to 2.7v in normal operation. pin configuration figure 3. pin configuration htssop-b20 hsop20 downloaded from: http:///
datasheet d a t a s h e e t 3/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp marking diagram and physical dimension electrical characteristics (unless otherwise noted, ta = 25 o c, vcc=24v) parameter symbol limit unit condition min. typ. max. [whole device] circuit current while in operation icc - 4.5 9 ma stb=3v,pwm=3v, rt=100k ? circuit current while in standby istb - 40 80 a stb=0v [reg58 block] reg58 output voltage reg58 5.742 5.8 5.858 v io=0ma reg58 available current ireg58 15 - - ma [uvlo block] uvlo release voltage vuvlo_vcc 6.5 7.5 8.5 v vcc=sweep up uvlo hysteresis voltage vuhys_vcc 150 300 600 mv vcc=sweep down [dc/dc block] error amp. reference voltage vled 0.35 0.37 0.39 v iset=75k ? , adim=2.5v oscillation frequency fsw 142.5 150.0 157.5 khz rt=100k ? max. duty cycle per output of n pin dmax 83 90 97 % rt=100k ? on resistance on n pin source side ronh - 4 8 ? ion=-10ma on resistance on n pin sink side ronl - 3 6 ? ion=10ma ss pin source current issso -4 -2 -1 ua ss=2v soft start completion voltage vss_end 3.3 3.7 4.1 v ss=sweep up fb sink current ifbsink 50 100 150 a led=2.0v, fb=1.0v fb source current ifbsource -150 -100 -50 a led=0v, fb=1.0v over current detection voltage vcs 0.40 0.45 0.50 v cs=sweep up figure 4. physical dimension d93941 lot no. htssop-b20 bd93941fp lot no. hsop20 downloaded from: http:///
datasheet d a t a s h e e t 4/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp electrical characteristics (unless otherwise noted, ta = 25 o c, vcc=24v) parameter symbol limit unit condition min. typ. max. [dc/dc protection block] overvoltage protection detection voltage vovp 2.7 3.00 3.3 v ovp=sweep up overvoltage protection detection hysteresis voltage vovp_hys 50 100 200 mv ovp=sweep down short circuit protection detection voltage vscp 0.04 0.10 0.25 v ovp=sweep down [led driver block] led pin current accuracy 1 diled1 -2 - 2 % iled=100ma, (adim=2.5v,iset=75k ? ) led pin current accuracy 2 diled2 -3.2 - 3.2 % iled=70ma, (adim=1.75v,iset=75k ? ) led pin current accuracy 3 diled3 -4.6 - 4.6 % iled= 5 0ma, (adim=1.25v,iset=75k ? ) led pin current accuracy 4 diled4 -8 - 8 % iled= 3 0ma, (adim=0.75v,iset=75k ? ) led pin current accuracy 5 diled5 -3 - 3 % iled=100ma, (adim=7v,iset=75k ? ) led pin leakage current illed -2.5 - 2.5 a led=60v led open detection voltage vopen 0.05 0.2 0.285 v led=sweep down led short detection voltage vshort 4 5 6 v led=sweep up adim pin input current iladim -2.5 - 2.5 a adim=3v [stb block] stb pin high-level voltage stbh 2 - 35 v stb=sweep up stb pin low-level voltage stbl -0.3 - 0.8 v stb=sweep down stb pin pull-down resistance rstb 500 1000 1500 k ? stb=3.0v [pwm block] pwm pin high-level voltage pwmh 2 - 35 v pwm=sweep up pwm pin low-level voltage pwml -0.3 - 0.8 v pwm= sweep down pwm pin pull-down resistance rpwm 180 300 420 k ? pwm=3.0v [failure indication block (open drain)] auto pin source current iauto -2 -1 -0.5 a auto=2v auto pin detection voltage vauto 3.6 4.0 4.4 v auto=sweep up abnormal detection timer tcp 20 ms rt=75k ? downloaded from: http:///
datasheet d a t a s h e e t 5/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp pin descriptions (bd93941efv) pin no pin name in/out function rating [v] 1 auto out auto-restart time setting pin -0.3 to 7 2 reg58 out power supply for n pin -0.3 to 7 3 cs in dc/dc output current detection and ocp detection pin -0.3 to 7 4 n out dc/dc switching output pin -0.3 to 7 5 dcdc_gnd - power gnd pin - 6 ovp in overvoltage protection detection pin -0.3 to 36 7 stb in enable pin -0.3 to 36 8 led1 out output pin 1 for led -0.3 to 60 9 led2 out output pin 2 for led -0.3 to 60 10 led_gnd - ground pin for led - 11 led3 out output pin 3 for led -0.3 to 60 12 led4 out output pin 4 for led -0.3 to 60 13 pwm in external pwm light modulation si gnal input pin for led1-4 -0.3 to 36 14 iset out led current setting resistor connection pin -0.3 to 7 15 gnd - analog gnd pin - 16 ss out soft start pin / led protecti on masking time setting pin. -0.3 to 7 17 fb in/out error amp output pin -0.3 to 7 18 rt out dc/dc drive frequency setting resistor connection pin. -0.3 to 7 19 adim in analog dimming dc voltage input pin -0.3 to 36 20 vcc in power supply pin -0.3 to 36 pin descriptions (bd93941fp) pin no pin name in/out function rating [v] 1 auto out auto-restart time setting pin -0.3 ~ 7 2 reg58 out power supply for n pin -0.3 ~ 7 3 cs in dc/dc output current detection and ocp detection pin -0.3 ~ 7 4 n in dc/dc switching output pin -0.3 ~ 7 5 dcdc_gnd - power gnd pin - fin1 gnd - - 6 ovp in overvoltage protection detection pin -0.3 ~ 36 7 stb in enable pin -0.3 ~ 36 8 led1 out output pin 1 for led -0.3 ~ 60 9 led2 out output pin 2 for led -0.3 ~ 60 10 led_gnd - ground pin for led - 11 n.c. - non connection pin - 12 led3 out output pin 3 for led -0.3 ~ 60 13 led4 out output pin 4 for led -0.3 ~ 60 14 pwm in external pwm light modulation signal input pin for led1-4 -0.3 ~ 36 15 iset out led current setting resistor connection pin -0.3 ~ 7 fin2 gnd - analog gnd pin - 16 ss out soft start pin / led protection masking time setting pin. -0.3 ~ 7 17 fb in/out error amp output pin -0.3 ~ 7 18 rt out dc/dc drive frequency setting resistor connection pin. -0.3 ~ 7 19 adim in analog dimming dc voltage input pin -0.3 ~ 36 20 vcc in power supply pin -0.3 ~ 36 downloaded from: http:///
datasheet d a t a s h e e t 6/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp pin esd type figure 5. pin esd type reg58 / n / dcdc_gnd / cs adim fb led1~4, led_gnd rt ss pwm iset stb ovp auto downloaded from: http:///
datasheet d a t a s h e e t 7/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp block diagram + + _ + + _ figure 6. block diagram downloaded from: http:///
datasheet d a t a s h e e t 8/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp typical performance curve figure 8. n frequency [mhz] vs. r_rt [k ? ] figure 7. operating current (icc) [ma] vs. vcc[v] figure 9. led current (iled) [ma] vs. temp [ o c] figure 10. led current (iled) [ma] vs. adim[v], [ ] [] _ [] [] [ ] [] vcc=24v ta=25c stb=3v, pwm=3v, rt=100k ? vcc=24v ta=25c riset=75k [] [] vcc=24v ta=25c riset=75k adim=2.5v downloaded from: http:///
datasheet d a t a s h e e t 9/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp pin function auto (1pin) this sets up time till auto-restart time from the point of abnormal detection. having 1 a constant current charge at external capacitor connected to auto pin, it will start again when it becom es over 4.0v (the auto pin is shorted to gnd, this ics protection function operates latched off mode). auto-restart period vs. auto capacitance (ideal) reg58 (2pin) the reg58 pin is used in the dc/dc converter driver block to output 5.8v power. the maximum operating current is 15ma. using the reg58 pin at a curr ent higher than 15ma can affect the n pin out put pulse, causing the ic to malfunction and leading to heat generation of the ic itself. to avoid this pr oblem, it is recommended to make load setting to the minimum level. please place the ceramic capacitor connected to reg58 pin (2.2 f 10 f) closest to reg58-gnd pin. cs (3pin) the cs pin has the following two functions: 1. dc/dc current mode current feedback function current flowing through the inductor is conv erted into voltage by the current sensi ng resistor rcs connected to the cs pin and this voltage is compared with voltage set with t he error amplifier to contro l the dc/dc output voltage. 2. inductor current limit function the cs pin also incorporates the over cu rrent protection (ocp) function. if the cs pin voltage reaches 0.45v (typ.) or more, switching operation will be forcedly stopped. n (4pin) the n pin is used to output power to the external nmos gate driver for the dc/dc converte r in the amplitude range of approx. 0 to reg58. on resistances is 4.0 ? (typ.) in sorrce (h side), 3.0 ? (typ.) in sink (l side). frequency setting can be made with a resistor connected to t he rt pin. for details of frequency setting, refer to the description of the rt pin. dcdc_gnd (5pin) the pgnd pin is a power ground pin for t he driver block of the output pin n. ovp (6pin) the ovp pin is an input pin for over-voltage protection and short circuit protection of dc/dc output voltage. if over-voltage is detected, the ovp pin will stop the dc/dc converter conduc ting step-up operation. when the short circuit protection (scp) function is activated, the dc/dc co nverter will stop operation, and then the timer will start counting. when the timer completes counting the preset period of time, the led drivers are stopped. the ovp pin is of the high impedance type and involves no pu ll-down resistor, resulting in unstable potential in the open-circuited state. to avoid this problem, be sure to make input voltage setting with the use of a resistive divider or otherwise. stb (7pin) the stb pin is used to make setting of turning on and off t he ic and allowed for use to reset the ic from shutdown. note: the ic state is switched (i.e., the ic is switched bet ween on and off state) according to voltages input in the stb pin. avoid using the stb pin betwe en two states (0.8 to 2.0v). led1 C led4 (8,9,11,12pin) the led1 to 4 pins are used to output co nstant current to led drivers. current value setting can be made by connecting a resistor to the iset pin. for the current value se tting procedure, refer to the description of iset pin. if any of the led pins is put in an errone ous state (e.g. short circuit mode, open circuit mode, or ground short circuit mode), the relevant protection function will be activated. led_gnd (10pin) the led_gnd pin is a power ground pin used for the led driver block. pwm (13pin) the pwm pin is used to turn on and off led drivers. light c an be modulated by changing the duty cycle through the direct input of a pwm light modulation signal. the high and low voltage levels of pwm pin is as listed in the table below: state pwm voltage led on state pwm= 2.0v to 35v led off state pwm= -0.3v to 0.8v [sec] 10 0.4 ] [ 10 0.1 ] [0.4 6 6 auto auto auto c a c v t ? ? ? ? ? ? ? downloaded from: http:///
datasheet d a t a s h e e t 10/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp iset (14pin) the iset pin is an output current setting resistor. output current iled varies in inverse proportion to resistance. the relation between output current iled and the resistance of i set pin connection resistor riset is given by the following equation: (adim=0.2v to2.7v) (adim>4v to 35v) output current setting should be made in the range of 30 to 200ma. it prepares automatically to suitable led feedback vo ltage that can output led current set by iset pin. in short led feedback voltage is dropped when the led curr ent is small and the ic heat ing is held automatically. in case of a large current is needed, raise the led pin feedba ck voltage. and it adjusts automatically to led pin voltage that can be flow large led current. the calculation is as below. the led feedback voltage (vled) is clamped to 0.3v (t yp.) when the led current (iled) is less than 81.1ma. adim input range is from 0v to 35v. and the range which t he led currents change with linearity is from 0.2v to 2.7v. when it reaches under viset0.90v(typ.), t he led current is off to prevent from passing a large current to the led pin when the riset is shorted and the iset pin is shorted to the gnd. and as the iset pin returns to a normal state, the led current returns. gnd (15pin) the gnd pin is an internal analog circuit ground of the ic. ss (16pin) the ss pin is used to make setting of soft start time and duty fo r soft start. it performs const ant current charge of 2.0 ua to the external capacitor connected with ss terminal, which enables soft-start of dc/dc converter. since the led protection function (open/s hort detection) works when the ss termi nal voltage reaches 3.7 v (typ.) or higher, it must be set to bring stability to conditions such as dc/dc output voltage and led cons tant current drive operation, etc. before the voltage of 3.7 v is detected. fb (17pin) the fb pin is an output pin used for dc/dc current mode control error amplifier. in other words, the fb pin detects the voltages of led pins (1 to 4) and controls inductor current so that the pin voltage of the le d located in the row with the highest vf will come to 0.37v (adim=2.5v, iled=100ma). as a result, the pin voltages of other leds become higher by vf variation. after completion of soft start, the fb pin is put into the high-impedance state with the pwm signal being in the low state, thus maintaining the fb voltage. rt (18pin) the rt pin is used to connect a dc/dc frequency setting resist or. dc/dc drive frequency is determined by connecting the rt resistor. ? drive frequency vs. rt resistance (ideal) when rt is 100k ? , fsw is 150khz(typ.). however, drive frequency setti ng should be made in the range of 100 khz to 800 khz. adim (19pin) adim pin is for analog dimming. output current is proporti onality with input voltage. basically, adim pin assumes the voltage inputted externally using high accuracy of resistive di vider and etc., ic internally is in open (high impedance) condition. cannot use in an open condition . if you don't use analog dimming, please connect pull- up resistor to over 5v (for example reg58). vcc (20pin) the vcc pin is used to supply power for the ic in the range of 9 to 35v. if the vcc pin voltage reaches 7.5v (typ.) or more, the ic will in itiate operation. if it reaches 7. 2v (typ.) or less, the ic w ill be shut down. ] [ 7500 ] [ k r ma i iset led ? ] [ ] [ 3000 ] [ v v k r ma i adim iset led ? ? ] [ ] [ 15000 ? ? k khz f r sw rt ][ ][ 7.3 v a i vled led ? ? downloaded from: http:///
datasheet d a t a s h e e t 11/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp startup operation and soft start (ss) capacitance setting the following section describes the s equence for the startup of this ic. ? description of startup sequence (1) set the stb and pwm pin to on. (2) set sll systems to on, ss charge will be initiated. at this time, a circuit in which ss pin voltage for soft st art becomes equal to fb pin voltage operates to equalize the fb pin and ss pin voltages regardless of whether the pwm pin is set to low or high level. (3) since the fb pin and ss pin reach t he lower limit of the internal sawtoot h wave of the ic, the dc/dc converter operates to start vout voltage rising. (4) the vout voltage continues rising to reach a voltage at which led current starts flowing. (5) when the led current reaches the set amount of current, isolate the fb circui t from the ss circuit. with this, the startup operation is completed. (6) after that, conduct normal operation following the feedback operation sequence with the led pins. if the ss pin voltage reaches 3.7v or more, the led protecti on function will be activated to forcedly end the ss and fb equalizing circuit. ? ss capacitance setting procedure as aforementioned, this ic stops dc/dc co nverter when the pwm pin is set to low level and conducts step-up operation only in the section in which the pwm pin is maintained at high level. consequently, setting the pwm duty cycle to the minimum will extend the startup time. the startup time also varies with application settings of output capacitance, led current, output voltage, and others. startup time at minimum duty cycle can be approximated according to the following method: make maeasurement of vout startup time with a 100% duty cycle, first. take this value as trise100. the startup time trise_min for the relevant application with the minimum duty cycle is given by the following equation. ] [ ] [ _ ] [ 100_ min _ sec ratio duty min sec t t rise rise ? however, since this calculation method is ju st for approximation, use it only as a guide. make setting of time during which the ss pin voltage reac hes the fb pin voltage longer than this startup time. assuming that the fb pin voltage is vfb, the time is given by the following equation: ] [ ] [2 ][ ][ sec a v vfb f c t ss ss ? ? ? as a result, it is recommended to make ss capacitance setting so that tss will be greater than trise_min _ = _ = figure 11. startup waveform figure 12. circuit behavior at startup downloaded from: http:///
datasheet d a t a s h e e t 12/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp ? about unused led terminal automatic detecting function this ic is detected automatical ly that it is an unused channel by asssuming the led terminal to be open at starting. it explains the sequence. sequence; stb=on all systems are on at initial ti ming of pwm=h. ss starts charging. when the output voltage is boosted enough, and enough curr ent flows through the led, led_ok signal is switched in the ic. pwm=l from the rise timing of this signal for about 20us during this pwm=l period, led pins with led connections' output voltage becomes 0.2v and above, where as unused led pins are below 0.2v. during this time, determination on whether t he led pins are 0.2v above/below is done. after the determination, unused led pins are pulled up to 5v. the auto signal remains l level. in addition, automatic determination of the open decision will only be in ss range, therefore, please set the application so that the step-up/boost be co mpleted before ss> 3.7v. figure 14. block diagram downloaded from: http:///
datasheet d a t a s h e e t 13/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp ] [ ] [ 15000 ? ? k khz f r sw rt led current setting setting of led output current iled can be made by connecting a resistor riset to the iset pin. ? riset vs. iled current relation equation however, led current setting should be made in the range of 30ma to 200ma. [setting example] to set iled current to 100ma, riset resistance is given by the following equation: dc/dc converter drive frequency setting dc/dc converter drive frequency is determined by making rt resistance setting. ? drive frequency vs. rt resistance (ideal) relation equation [setting example] to set dc/dc drive frequency fsw to 200 khz, rrt is given by the following equation: ] [ ] [ 7500 ? ? k ma i r led iset ] [ 75 ] [ 100 7500 ] [ 7500 ? ? ? ? k ma ma i r led iset where fsw ? dc/dc converter oscillation frequency [khz] this equation has become an ideal equation without any correction item included. for accurate frequency settings, thorough verification should be performed on practical sets. ] [ 75 ] [ 200 15000 ] [ 15000 ? ? ? ? k khz khz f r sw rt (adim=2.5v) downloaded from: http:///
datasheet d a t a s h e e t 14/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp ovp/scp settings ovp pin is dc/dc output voltages over voltage prot ection and short circuit protection input pin. ovp pin is a high impedance pin with no pull down re sistor. thus, at open state please set the voltage input settings using voltage dividing resistor and such. respective ovp pin protection conditions are as below protection name detection pin detection condition cancellation condition timer operations protection type ovp ovp ovp>3.0v ovp<2.9v no dcdc stops during detection scp ovp ovp<0.1v ovp>0.1v yes all latch ovp detection setting vout abnormally increase voltage detected by ovp, vovp det, r1,r2 settings are as follows ovp cancellation setting r1,r2 set from above equation, ovp cancellation voltage vovp can equals to scp detection setting when r1,r2 are set using values obtained above, scp voltage setting is vscp det is as follows setting example vout at normal operation 56v ovp detection voltage vovp det =68v r2=10k, r1 is as follows when r1, r2 are set at these values, ovp cancellation voltage, vovp can in addition, at this r1, r2, scp detection voltage to select dc/dc components, give consideration to ic variations as well as individual component varia tions, and then conduct thorough veri fication on practical systems. ] [ ][0.3 ]) [0.3 ][ ( ] [2 1 ? ? ? ? ? k v v v vovp k r r det ][ ] [2 ]) [2 ] [1( 9.2 v k r k r k r v vovp can ? ? ? ? ? ? ] [ 7. 216 ][3 ]) [3 ][68( ] [10 ][0.3 ]) [0.3 ][ ( ] [2 1 ? ? ? ? ? ? ? ? ? ? k v v v k v v v vovp k r r det ][ 7.65 ][ ] [10 ] [7. 216 ] [10 ][9.2 ] [2 ]) [2 ] [1( ][9.2 v v k k k v k r k r k r v vovp can ? ? ? ? ? ? ? ? ? ? ? ? ? ][ ] [2 ]) [2 ] [1( 1.0 v k r k r k r v vscp det ? ? ? ? ? ? ][ 27.2 ][ ] [10 ] [7. 216 ] [10 ][1.0 ] [2 ]) [2 ] [1( ][1.0 v v k k k v k r k r k r v vscp det ? ? ? ? ? ? ? ? ? ? ? ? ? figure 15. ovp/scp setting example downloaded from: http:///
datasheet d a t a s h e e t 15/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp timer latch time setting this ic has a built-in timer latch counter. timer latch time is set by counting the clock frequency which is set at the rt pin. after timer latch time when various abnormal conditions happen, counting starts from the timing, latch occurs after below time has passed. furthermore, even if pwm=l, if abnormal conditi on continues, timer count will not reset. here, latch time = time until latch condition occurs r rt = resistor value connected to rt pin setting example timer latch time when rt=75kohm ][ 10 5.1 ] [ 4096 10 5.1 2 7 10 12 s k r r latch rt rt time ? ? ? ? ? ? ? figure 16. example of led short protection timing chart ][ 02 .0 10 5.1 ] [ 75 4096 10 5.1 ] [ 4096 7 7 s k k r latch rt time ? ? ? ? ? ? ? ? ? downloaded from: http:///
datasheet d a t a s h e e t 16/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp ocp settings/dcdc components curre nt capacity selection method one of the function of cs pin - when its pin voltage> 0.45 it stops the dcdc. thus, rcs resistor value need to be checked after the peak current flow throug h the inductor is calculated. furthermore, dcdc external components current capacity needs to be greater than peak current flowing through this inductor. inductor peak current ip eak calculation method firstly, ripple voltage which occurs at the cs pin is decided depending on the dcdc application conditions. the conditions when made as below; output voltage=vout[v] led total current=iout[a] dcdc input voltage=vin[v] dcdc efficiency = [%] total required average input current iin: inductor ripple current il[a] which occurs at inductor l[h] during dcdc drive operation with switching frequency=fsw[hz] is as follows therefore, ils peak current ipeak can be calculated using below equation (resistor rcs connected to cs pin selection method) this ipeak flows in rcs and generates voltage. (refer to time chart diagram on the right). this voltage value, vcspeak can be calculated as below this vcspeak when reach 0.45v, will stop the dcdc output. thus when selecting rcs value, below condition needs to be met. (dcdc components current capacity selection method) when ocp reach detection voltage cs=0.45v, iocp current ipeak current (1) i ocp current (2) and components max current capacity needs to satisfy the following above condition needs to be satisfied when selecting dcdc application parts eg. fet, inductor, diode etc. furthermore, continuous mode is recommended for normal dcdc ap plications. inductors ripple current min limit value, lmin becoming is a condition to be met. if this is not met, it is called discontinuous mode. ][ [%] ][ ][ ][ a v v a i v v i in out out in ? ? ? ? ][ ] [ ][ ] [ ][ ]) [ ][ ( a hz f v v h l v v v v v v il sw out in in out ? ? ? ? ? )1( ][ 2 ][ ][ ? a a il a i ipeak in ? ? ? ] [ v ipeak rcs vcs peak ? ? ? ? ocp peak i i )2( ] [ ] [ ] [45.0 ? a rcs v i ocp ? ? ] [45.0 ] [ ] [ v a ipeak rcs ? ? ? rated current of components 0 ][ 2 ][ ][ im ? ? ? ? a a il a i in in figure 17. dc/dc convertor application circuit figure 18. inductor current waveform downloaded from: http:///
datasheet d a t a s h e e t 17/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp setting example output voltage=vout[v]=56v led total current=iout[a]=100ma4ch=0.40a dcdc input voltage=vin[v]=14v dcdc efficiency= [%]=90% total required average input current iin: when, dcdc switching frequency =fsw[hz]=200khz inductor l[h]=33uh, inductor ripple current il[a]: thus, il peak current ipeak becomes rcs resistor value when set at 0.1ohm and satisfy the condition. in addition ocp detection current i ocp at this time is if parts used (fet,inductor diode etc)s current capacity<5a, thus, there is no problem of parts select ion as the above condition is satisfied. in addition il ripple current minimum limit imin is thus will not become discontinuous mode to select dc/dc components, give consideration to ic variations as well as individual component variations, and then conduct thorough verification on practical systems. ] [ 78 .1 [%] 90 ] [ 14 ] [ 40 .0 ] [ 56 [%] ] [ ] [ ] [ ] [ a v a v v v a i v v a i in out out in ? ? ? ? ? ? ? ? ] [ 59.1 ] [ 10 200 ] [56 ] [ 10 33 ] [14 ]) [14 ] [56( ] [ ] [ ] [ ] [ ]) [ ] [ ( 3 6 a hz v h v v v hz f v v h l v v v v v v il sw out in in out ? ? ? ? ? ? ? ? ? ? ? ? ? ? ] [ 58.2 2 ] [59.1 ] [78.1 ] [ 2 ] [ ] [ a a a a a il a i ipeak in ? ? ? ? ? ? 0 ] [ 985 .0 ] [ 795 .0 ] [78.1 ] [ 2 ] [ ] [ im ? ? ? ? ? ? ? a a a a a il a i in in v v a ipeak rcs vcs peak 45.0 ] [ 258 .0 ] [ 58.2 ] [ 10.0 ? ? ? ? ? ? ? ] [ 5.4 ] [1.0 ] [45.0 a v i ocp ? ? ? ? ? ocp peak i i rated current of components ] [5 ] [5.4 ] [58.2 a a a ? ? ? peak current calculation result rcs resistor consideration dcdc current capacity consideration downloaded from: http:///
datasheet d a t a s h e e t 18/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp selection of inductor l the value of inductor has significant in fluence on the input ripple current. as shown by equation (1), the larger t he inductor and the higher the switching frequency, the inductor ripple current ? il becomes increasingly lower. (1) ][ ) ( ????? a f v l v v v il sw out in in out ? ? ? ? ? expressing efficiency as shown by equation (2), peak input current is given as equation (3). (2) ????? in in out out i v i v ? ? ? ? (3) 2 2 ????? il v i v il i il in out out in max ? ? ? ? ? ? ? where, l: reactance value [h], v out : dc/dc output voltage [v], v in : input voltage [v], i out : output load current (total output current) [a], i in : input current [a], and f sw : oscillation frequency [hz] . note: if a current in excess of the rated current of the i nductor applies to the coil, the inductor will cause magnetic saturation, resulting in efficiency degradation. select an inductor with an adequate margin so that peak current will not exceed the rated current of the inductor. note: to reduce power dissipation from and increase efficiency of inductor, select an inductor with low resistance component (dcr or acr). selection of output capacitor c out select a capacitor on the output side taki ng into account the stability region of output voltage and equivalent series resistance necessary to smooth ripple voltage. note that higher output ri pple voltage may result in a drop in led pin voltage, making it impossible to supply set led current. the output ripple voltage ? v out is given by equation (4). (4) ][ 1 1 ????? v f i c r ilmax v sw out out esr out ? ? ? ? ? ? where r esr ? equivalent series resistance of c out . note: select capacitor rati ngs with an adequate margin for output voltage. note: to use an electrolytic capacitor, an adequate margin should be provided for permissible current. particularly to apply pwm light modulation to led, note that a current higher than the set led current transiently flows. selection of switching mosfet transistors there will be no problem for switching mosfet transistors hav ing absolute maximum rating higher than rated current of the inductor l and vf higher than c out breakdown voltage ? rectifier diode. however, to ac hieve high-speed switching, select transistors with small gate capacity (injected charge amount). note: rated current larger than over current protection setting current is recommended. note: selecting transistors with low on resistance can obtain high efficiency. selection of rectifier diodes select schottky barrier diodes having current capability higher than the rated current of the inductor l and inverse breakdown voltage higher that c out breakdown voltage, particularly having low forward voltage vf. v out v in c out r cs l i l v out v in c out r cs l r esr i l figure 20. output capacitor diagram, figure 19. inductor current waveform and diagram downloaded from: http:///
datasheet d a t a s h e e t 19/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp phase compensation setting procedure dc/dc converter application for current mo de control includes one each of pole f p (phase delay) by cr filer consisting of output capacitor and output resistor (i.e., led current) and zero (phase lead) f z by the output capacitor and capacitor esr. furthermore, the step-up dc/dc converter includes rhp zero f zrhp as the second zero. since the rhp zero has phase delay ( ? 90 ? ) characteristics like the pole, the crossover frequency f c should be set to not more than rhp zero i. find pole f p and rhp zero f zrhp of dc/dc converter. where ? total led current [a], ii. find phase compensation to be insert ed in the error amplifier. (set f c to 1/5 of f zrhp .) where iii. find zero used to compensate esr (r esr ) of c out (electrolytic capacitor). note: even if a ceramic capacitor (r esr of the order of milliohms) for c out , it is recommended to insert c fb2 for stable operation. to improve transient response, it is necessary to increase r fb1 and reduce c fb1 . however, this improvement reduces a phase margin. to avoid this problem, conduct thorough verification, including variations in external components, on practical systems. v out vin c out r cs l r esr + c fb1 fb r fb1 gm v out i led c fb2 ] [ 2 ) 1( 2 hz i l d v f led out zrhp ? ? ? ? ? ? ] [ ) 1( 5 1 ? ? ? ? ? ? ? ? ? d v gm f i r f r out p led cs rhzp fb ] [ 2 5 2 1 1 1 1 f f r f r c zrhp fb c fb fb ? ? ? ? ? ? ? ? ] [ 1 2 f r c r c fb out esr fb ? ? ] [ 2 hz c v i f out out led p ? ? ? ? out in out v v v d ? ? ][ 10 0.4 4 s gm ? ? ? led i figure 21. output stage and error amplifier diagram downloaded from: http:///
datasheet d a t a s h e e t 20/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp = _ _ __ _ _ timing chart figure 22. timing chart downloaded from: http:///
datasheet d a t a s h e e t 21/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp list of protect function (typ condition) protection name detection pin detection conditions cancellation conditions protection type detection pin pwm ss led open led ledx < 0.2v h ss>3.7v ledx > 0.2v immediately auto-restart after detection (judge periodically whether normal or not) ledshort led ledx > 5v h ss>3.7v ledx < 5v immediately auto-restart after detection (judge periodically whether normal or not) iset gnd short iset under - - above auto-restart iset90% iset90% reg58 uvlo reg58 reg58<2.4v - - reg58>2.6v auto-restart vcc uvlo vcc vcc<7.3v - - vcc>7.5v auto-restart ovp ovp ovp>3.0v - - ovp<2.9v auto-restart scp ovp ovp<0.1v - - ovp>0.1v immediately auto-restart after detection (judge periodically whether normal or not) fb over shoot fb fb>4v - - fb<3.6v immediately auto-restart after detection (judge periodically whether normal or not) ocp cs ocp>0.45v - - - pulse-by-pulse to clear the latch type, stb should be set to l once, and then to h. protection function operation after the protection function detected dc/dc led driver soft-start led open continue to operate only detects led, stops after cp1 count continue to operate ledshort continue to operate only detects led, stops after cp1 count continue to operate iset gnd short stop immediately stop immediately continue to operate stb stop immediately stop (and when reg58<2.4v) discharge immediately reg58 uvlo stop immediately stop immediately discharge immediately vcc uvlo stop immediately stop immediately discharge immediately ovp stop immediately (n pin only) continue to operate continue to operate scp stop immediately (n pin only) stop after cp1 count discharge after cp1 count fb over shoot stop after cp2 count stop after cp2 count continue to operate ocp n pin limits duty continue to operate continue to operate * cp1 = 20ms (rt=75k ? ) , cp2=1.31s (rt=75k ? ) downloaded from: http:///
datasheet d a t a s h e e t 22/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
datasheet d a t a s h e e t 23/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp operational notes C continued 10. unused input terminals input terminals of an ic are often con nected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 11. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 23. example of monolithic ic structure 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissipation are all within the area of safe operation (aso). 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 15. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in pr eventing damage due to sudden and unexpecte d incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. downloaded from: http:///
datasheet d a t a s h e e t 24/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp ordering information b d 9 3 9 4 1 f p - e 2 part number package efv: htssop-b20 fp : hsop20 packaging and forming specification e2: embossed tape and reel marking diagrams htssop-b20 (top view) d93941 part number marking lot number 1pin mark hsop20 (top view) bd93941fp part number marking lot number 1pin mark downloaded from: http:///
datasheet d a t a s h e e t 25/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp physical dimension, tape and reel information 1 package name htssop-b20 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t 26/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp physical dimension, tape and reel information 2 package name hsop20 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin a. 5.5 ilu. burr draig . downloaded from: http:///
datasheet d a t a s h e e t 27/27 tsz02201-0f1f0c100270-1-2 ? 2013 rohm co., ltd. all rights reserved. 12.aug.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd93941efv bd93941fp revision history date revision changes 10.oct.2013 001 draft version 24.dec.2014 002 p.2 adim input voltage1 (use adim function) add adim range at start up and add note *3 12.aug.2015 003 p.3 [reg58 block] soft start completion voltage -> reg58 available current downloaded from: http:///
datasheet datasheet notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radi ation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BD93941FP-E2

	To Download BD93941FP-E2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .